# PCB Trends 2024-2025: 10 เทรนด์ที่ต้องรู้
อุตสาหกรรม PCB กำลังเปลี่ยนแปลงเร็วกว่าที่เคย บทความนี้สรุป 10 เทรนด์สำคัญสำหรับปี 2024-2025
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สารบัญ
- AI Hardware Boom
- EV & Battery
- HDI & Substrate-like
- 5G/6G Infrastructure
- Miniaturization
- Sustainability
- Supply Chain
- Advanced Packaging
- Automation
- Market Outlook
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Market Overview
```
Global PCB Market Size
═══════════════════════════════════════════════════════════
Year │ Market Size │ Growth
────────┼─────────────┼────────
2023 │ $70B │ -
2024 │ $75B │ +7%
2025 │ $82B │ +9%
2026 │ $89B │ +9%
2027 │ $97B │ +9%
CAGR 2024-2027: ~8-9%
By Segment (2024):
├── Multilayer: 40%
├── Double-sided: 25%
├── HDI: 15%
├── Flex/Rigid-Flex: 12%
├── Single-sided: 5%
└── Others: 3%
═══════════════════════════════════════════════════════════
```
---
1. AI Hardware Boom {#ai}
AI Driving PCB Demand
```
AI Hardware PCB Requirements
═══════════════════════════════════════════════════════════
Data Centers (AI Training):
├── High-layer count (20-30+ layers)
├── Low-loss materials (Megtron, Rogers)
├── High-speed designs (112Gbps+)
├── Power delivery (1000W+ per GPU)
└── Thermal management critical
Edge AI (Inference):
├── Compact designs (HDI, substrate)
├── Low power optimization
├── Integrated NPUs
├── Cost-sensitive
└── Volume growth
AI PCs/Devices:
├── NPU integration
├── DDR5 routing
├── Advanced packaging
└── Consumer price points
═══════════════════════════════════════════════════════════
```
Market Impact
| Segment | Growth 2024-2025 |
|---|---|
| AI server PCB | +30-40% |
| HPC interconnect | +25-30% |
| Edge AI devices | +20-25% |
---
2. EV & Battery {#ev}
EV PCB Requirements
| Application | PCB Type | Growth |
|---|---|---|
| BMS | FR4/Aluminum | +20% |
| Motor inverter | Ceramic/IMS | +25% |
| Charger | Heavy copper | +30% |
| ADAS | HDI | +35% |
| Infotainment | Standard | +15% |
Key Technologies
- High current PCB (>150A)
- High voltage isolation (800V+)
- Wide temperature range (-40 to +150°C)
- Vibration resistance
---
3. HDI & Substrate-like PCB {#hdi}
HDI Evolution
```
HDI Technology Progression
═══════════════════════════════════════════════════════════
Generation │ Features │ Applications
───────────┼───────────────────────┼────────────────────
Type I │ 1 buildup layer │ Smartphones (legacy)
Type II │ 2 buildup layers │ Mid-range phones
Type III │ 3+ buildup layers │ Flagship phones
ELIC │ Every Layer IC │ Premium smartphones
mSAP │ Modified SAP │ Advanced IC substrate
SLP │ Substrate-Like PCB │ Wearables, modules
Key trends:
├── Line/space: 25μm → 15μm → 10μm
├── Via diameter: 100μm → 75μm → 50μm
├── Layer count increasing
└── Blurring line with IC substrate
═══════════════════════════════════════════════════════════
```
---
4. 5G/6G Infrastructure {#telecom}
Telecom PCB Requirements
| Technology | Material | Dk | Df |
|---|---|---|---|
| Sub-6GHz | High-speed FR4 | 3.5-4.0 | 0.008-0.012 |
| mmWave 5G | Rogers/PTFE | 2.9-3.5 | 0.002-0.005 |
| 6G (future) | LCP/MPI | 2.8-3.2 | <0.002 |
Growth Areas
- Massive MIMO antennas
- Small cell deployment
- O-RAN equipment
- Satellite (LEO) terminals
---
5. Miniaturization {#miniaturization}
Continuing Trend
```
Component Size Evolution
═══════════════════════════════════════════════════════════
Capacitors/Resistors:
├── 0402 (1.0x0.5mm) - Standard
├── 0201 (0.6x0.3mm) - Mainstream mobile
├── 01005 (0.4x0.2mm) - Premium mobile
└── 008004 (0.25x0.125mm) - Emerging
Impact on PCB:
├── Finer lines/spaces needed
├── More precise registration
├── Better solder paste control
├── Advanced inspection required
└── Higher equipment investment
═══════════════════════════════════════════════════════════
```
---
6. Sustainability {#sustainability}
Green PCB Trends
| Trend | Status |
|---|---|
| Lead-free (RoHS) | Mandatory |
| Halogen-free | Growing adoption |
| Recyclable materials | R&D phase |
| Reduced water usage | Implementing |
| Carbon footprint | Tracking started |
| Waste reduction | Target: -30% |
Regulatory Drivers
- EU Green Deal
- REACH updates
- Customer ESG requirements
- Carbon disclosure
---
7. Supply Chain Changes {#supply-chain}
Reshoring & Diversification
```
Supply Chain Trends
═══════════════════════════════════════════════════════════
China+1 Strategy (accelerating):
├── Thailand - Automotive focus
├── Vietnam - Consumer electronics
├── India - Domestic market
├── Malaysia - Semiconductor
└── Mexico - North America supply
Drivers:
├── Geopolitical risk
├── Tariff avoidance
├── Customer requirements
├── ESG considerations
└── Resilience focus
Impact:
├── Multiple qualified sources
├── Regional inventory buffers
├── Longer qualification cycles
└── Premium for non-China option
═══════════════════════════════════════════════════════════
```
---
8. Advanced Packaging {#packaging}
PCB & Packaging Convergence
| Technology | Description | Growth |
|---|---|---|
| FC-BGA substrate | Flip-chip BGA | +15% |
| ABF substrate | Advanced IC package | +25% |
| Chiplet interposer | Multi-die package | +40% |
| Embedded components | Components in PCB | +20% |
---
9. Automation & Industry 4.0 {#automation}
Factory Automation
```
Smart Factory Adoption
═══════════════════════════════════════════════════════════
Automation Level:
├── Basic (single machine) - Common
├── Connected (MES integration) - Growing
├── Smart (AI-driven) - Emerging
└── Autonomous (lights-out) - R&D
Technologies:
├── Real-time SPC monitoring
├── AI defect detection
├── Digital twin simulation
├── Predictive maintenance
├── Automated material handling
└── Paperless documentation
Benefits:
├── Quality improvement: -30% defects
├── Efficiency gain: +15-20%
├── Lead time reduction: -25%
└── Labor cost saving: -20%
═══════════════════════════════════════════════════════════
```
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10. Market Outlook {#outlook}
Growth by Segment
| Segment | 2024 | 2025 | Driver |
|---|---|---|---|
| AI/Data Center | +35% | +30% | AI investment |
| Automotive | +15% | +18% | EV adoption |
| Mobile | +5% | +8% | Replacement cycle |
| Industrial | +8% | +10% | Automation |
| Consumer | +3% | +5% | Modest growth |
Key Takeaways
> สรุปจากผู้เชี่ยวชาญ: "2024-2025 เป็นช่วงเวลาที่น่าตื่นเต้นสำหรับอุตสาหกรรม PCB AI และ EV กำลังสร้าง demand ใหม่ และ technology ก้าวหน้าเร็วมาก ผู้ที่ไม่ปรับตัวจะถูกทิ้งไว้ข้างหลัง" — Hommer Zhao
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